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The present invention relates to a wafer test board for a semiconductor device, and more particularly to a wafer test board which is formed on a semiconductor wafer to perform wafer test.
2. Description of the Related Art
In the past, a semiconductor device was designed in a semiconductor chip before fabricating the semiconductor device on a semiconductor wafer and then a wafer test of the semiconductor device was performed. A front surface of the semiconductor wafer was masked, so that the designed semiconductor device was directly formed on the semiconductor wafer.
Recently, it is a common practice to design a semiconductor device after it is fabricated on a semiconductor wafer and then a wafer test of the semiconductor device is performed. Such a semiconductor wafer is referred to as a semiconductor device wafer (hereinafter, a wafer to be tested is generally referred to as a wafer to be tested).
A wafer test is a test of the wafer to be tested after fabrication thereof.
Recently, by including an internal circuit other than a core circuit of the semiconductor wafer, the semiconductor wafer is fabricated in consideration of various external input signals applied thereto.
In the wafer test, if various external input signals are applied to the semiconductor wafer, the external input signals are applied to the internal circuit of the semiconductor wafer through a probe for probing the wafer to be tested. The probe is generally formed on a flat plate. However, when probing the semiconductor wafer, the flat plate is in close contact with the wafer to be tested, in order to easily load and unload the test pattern (pattern) to the wafer to be tested. For this reason, when probing the semiconductor wafer, the flat plate contacting the wafer may become deformed by the wafer to be tested and the probe, and the flat plate and the wafer may not be satisfactorily connected.
A semiconductor wafer test board is formed on the semiconductor
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